During the manufacturing process, Chips need to be polished and ground layer by layer, while the surface of the Wafer is also uneven. Additionally, there is a lot of dust during the production process. Therefore, chemical mechanical planarization is needed to help smooth out the surface. This involves using a polishing solution and a polishing brush, and through friction and rotation, the uneven parts are smoothed out. Grinding and polishing are necessary for the production of semiconductor Chips and Wafers.

Recommendation:

Slurry, Polishing, Phosphoric acid